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First published on March 4, 2008
Journal of Composite Materials 2008, doi:10.1177/0021998308088620

Article

Bismaleimides (1,3-Bismaleimidobenzene and 1,1'-bis(4-Maleimidophenyl) Cyclohexane) Modified Polyethersulfone/Epoxy Matrices for Engineering Applications

Rajangam Rajasekaran1 and Muthukaruppan Alagar2*

1 Department of Chemistry, St. Joseph's College of Engineering Chennai – 600 119, India
2 Department of Chemical Engineering, Anna University, Chennai – 600 025, India

* To whom correspondence should be addressed.


  Abstract

Bismaleimides (BMI) modified polyethersulfone (PES)-epoxy interpenetrating networks were developed. Epoxy systems modified with 4%, 8%, and 12% (by wt) of polyethersulfone were made by using epoxy resin (DGEBA) and polyethersulfone with diaminodiphenylmethane as curing agent. The polyethersulfone-toughened epoxy systems were further modified with 4%, 8%, and 12% (by wt) of bismaleimides, namely 1,3-bismaleimiobenzene and 1,1'-bis(4-maleimidophenyl) cyclohexane. BMI-PES–Epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat deflection temperature (HDT) analysis. The DSC thermograms of polyethersulfone-modified epoxy and BMI-modified epoxy during cure show unimodal reaction exotherms. The studies indicate that thermal stability and resistance to water absorption of epoxy resin has been enhanced by the introduction of polyethersulfone. The incorporation of bismaleimide into unmodified epoxy and PES–epoxy enhanced the thermal and mechanical properties according to its percentage content. The morphologies of fractured surfaces of modified epoxy systems were compared with that of unmodified epoxy system.

Key Words: bismaleimide, hydroxyl terminated polyethersulfone, epoxy resin, thermal stability, glass-transition temperature, heat deflection temperature, water absorption, morphology.


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