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Journal of Composite Materials
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Cure Behavior of Epoxy Resin E51–Melamine Phosphate (MP)–MeTHPA–2,4-EMI Halogen-free Fire Retardant Composite by the Dynamic Torsional Vibration Method

Cheng Yiyun

School of Life Sciences, University of Science and Technology of China Hefei 230027, Anhui, PR China; Department of Polymer Science and Engineering University of Science and Technology of China Hefei, 230026, Anhui, PR China; yycheng{at}mail.ustc.edu.cn

He Pingsheng

Department of Polymer Science and Engineering University of Science and Technology of China Hefei, 230026, Anhui, PR China

The cure behavior of epoxy resin E51–melamine phosphate (MP)–methyltetrahydrophthalic anhydride (MeTHPA)–2-ethyl-4-methyl-imidazole (2,4-EMI) halogen-free fire retardant composite at varying temperatures and MP loading is investigated by the dynamic torsional vibration method (DTVM). The dynamic parameters, such as gelation time tg, apparent activation energy Ea, and curing rate k are estimated as well. The theoretical prediction is in good agreement with the experimental results obtained by the DTVM. The results show that the rate of cure reactions depends distinctly on the cure temperature. At low MP loadings, the tg for the systems does not change obviously, while at higher MP loadings, it has a remarkable increase. Furthermore, the Flory's gelation theory and the Avrami equation are used to describe the cure behavior of the halogen-free fire retardant composite system.

Key Words: epoxy resin • cure behavior • Flory's theory • Avrami equation • melamine phosphate • halogen-free fire retardant

This version was published on July 1, 2006

Journal of Composite Materials, Vol. 40, No. 13, 1215-1223 (2006)
DOI: 10.1177/0021998305057430


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