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Stress Distribution in Bonded Joints *

Lehigh University Bethlehem, Pennsylvania 18015

M. Ratwani

Lehigh University Bethlehem, Pennsylvania 18015

The stress distribution in plates bonded through stepped joints is analyzed. The problem is solved under the assumption of gen eralized plane stress. A series of examples are worked out on specific plate geometries and material combinations. The effect of step ends is separately studied. As a limiting case, the solution for bonded plates with a smoothly tapered joint is given, and its results are compared with that of stepped joint.

Journal of Composite Materials, Vol. 5, No. 3, 378-393 (1971)
DOI: 10.1177/002199837100500308


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